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[1] US Patent 5,492,235, ¡°Process for single mask C4 solder bump fabrication¡± (1996)

[2] KOR Patent 10-0673264, ¡°Á¤º¸ ÀúÀå ÀåÄ¡ ¹× ±×ÀÇ ±¸µ¿ ¹æ¹ý¡± (2007)

[3] KOR Patent 10-2009-0103526, À̼±¿µ, ±ÇÁøÇü, ±è¾çÈñ, ±è¼ºÀÏ, "¹ÙÀÌ¿À ÇÊÅÍ ¹× ±× Á¦Á¶ ¹æ¹ý" (2009)

[4] KOR Patent 10-0999972, À̼±¿µ, ÃÖ¿ë¹ü, ¼º¹Ì¸°, À̰迵, ÃÖÁ¤¿µ, ¡°ÀÚ±âÁ¶¸³ ´ÜºÐÀÚÃþÀÌ ÄÚÆÃµÈ ±Ý¼Ó ³ª³ëÀÔÀÚÀÇ Á¦Á¶¹æ¹ý ¹× Á¦Á¶ÀåÄ¡¡± (2010)

[5] KOR Patent 10-2008-0051778, ½Åµ¿Çõ, À¯ºÀ¿µ, À̼±¿µ, Ȳ´ö¿µ, Á¶ÇöÈñ, Á¤±ÔºÀ, ¡°±Ý¼Ó¸· ¿¡Äª ¿ë¾× ¹× À̸¦ ÀÌ¿ëÇÑ ±Ý¼Ó¸· ¿¡Äª ¹æ¹ý¡± (2010)

[6] KOR Patent 10-1002400, À̼±¿µ, ¹ÚÁ¾ÇÏ, ·ù»õÈñ, ÃÖÁ¤¼ö, ¡°Ä¡¾Æ ¼öº¹Àç Á¦Á¶ ¹æ¹ý ¹× ÀÌ¿¡ µû¶ó Á¦Á¶µÈ Ä¡¾Æ ¼öº¹À硱 (2010)

[7] KOR Patent 10-0967629, À̼±¿µ, ¹ÚÁ¾ÇÏ, ·ù»õÈñ, ¡°°æ»ç±â´ÉÀç·á, ±× Á¦Á¶¹æ¹ý, ±× Á¦Á¶ÀåÄ¡ ¹× À̸¦ ÀÌ¿ëÇÑ ÀÌÁ¾Àç·á°£ °æ»ç±â´ÉÀç·á Á¢ÇÕ¹æ¹ý¡± (2010)

[8] KOR Patent 10-1063755, À̼±¿µ, ÃÖ¿ë¹ü, ¼º¹Ì¸°, À̰迵, ¡°±Ý¼Ó ³ª³ëÀÔÀÚ»óÀÇ ÀÚ±âÁ¶¸³´ÜºÐÀÚÃþ ÄÚÆÃÀåÄ¡ ¹× À̸¦ ÀÌ¿ëÇÑ ÄÚÆùæ¹ý¡± (2011)

[9] KOR Patent 10-2012-0049599, À̼±¿µ, ±èÇü¼·, ¸¶¹Ì´­ÇÏÅ¥, ±è°æ¼·, ¡°±¸¸®½ÃÆ® ¾ç¸é¿¡ Ä«º»½ÃÆ®°¡ ±¸ºñµÈ Àü±ØÀ¸·ÎºÎÅÍ ±¸¸®½ÃÆ®¸¦ ºÐ¸®ÇÏ´Â ¹æ¹ý¡± (2012)

[10] KOR Patent 10-2012-0094520, À̼±¿µ, ±èÇü¼·, ¾ç½Â±Ô, ¡°°æ»ç±â´ÉÀç·á Á¶¼º¹°À» ÀÌ¿ëÇÑ ÄÚÆùæ¹ý ¹× °æ»ç±â´ÉÀç·á Á¶¼º¹°¡± (2012)

[11] KOR Patent 10-2012-1141687, À̼±¿µ, ¹é½ÂÈ£, ÀÓ¿ì¼±, ¡°¾ÐÀü¼ÒÀÚ¸¦ ÀÌ¿ëÇÑ ¹ß¿­ÀåÄ¡ ¹× À̸¦ Æ÷ÇÔÇÏ´Â ½Å¹ß±ò⡱ (2012)

[12] KOR Patent 10-2009-0097289, À̼±¿µ, ¼Û¿ìÁø, Á¤±ÔºÀ, ¡°ºÐ¸»Ä«Æ®¸®Áö¡± (2012)

[13] KOR Patent 10-2013-1234756, À̼±¿µ, ¼­µ¿Èñ, ¾ç½Â±Ô, Á¶´ÜÀÌ, ¡°Àڿܼ± ¿¤À̵𸦠ÀÌ¿ëÇÑ ÈÞ´ë¿ë Àڿܼ± »ì±Õ±â¡± (2013)

[14] KOR Patent 10-2013-0153544, À̼±¿µ, ÃÖ´ÙÇö, Á¶´ÜÀÌ, À±ÀÇÇÑ, ÀÌÅÂÀ±, ÀÌ»ó±Ù, ¡°±Ý¼Ó-ź¼Ò º¹ÇÕ ÀÔÀÚÀÇ Á¦Á¶ ¹æ¹ý¡± (2013)

[15] KOR Patent 10-2015-0014504, À̼±¿µ, ±èÇü¼·, ¾È¼ºÈÆ, ¡°Àü±â º¯»ö ¹Ú¸·, ±× Á¦Á¶ ¹æ¹ý, ¹× À̸¦ Æ÷ÇÔÇÏ´Â Àü±â º¯»ö ¼ÒÀÚ¡± (2015)

[16] KOR Patent 10-2015-0061794, À̼±¿µ, ±èÇü¼·, ¹ÚÀ±Âù, ¡°Å¾ç ÀüÁö ¹× ±× Á¦Á¶ ¹æ¹ý¡± (2015)

[17] KOR Patent 10-2015-0131424, À̼±¿µ, ±èÇü¼·, ¹ÚÀ±Âù, ¡°¸¶ÀÌÅ©·Î ºÐ¸»À» ÀÌ¿ëÇÑ ´Ù°øÁú ±¸Á¶ Çü¼º ¹× ±× ÃÖÀûÈ­ Á¶°Ç¡± (2015)

[18] KOR Patent 10-2016-0014375, À̼±¿µ, ¡°»ó¿Â ÇöóÁ ÇÏÀ̺긮µå ºÐ¸» ÀûÃþ ¹æ½ÄÀ» ÀÌ¿ëÇÑ ½º¸¶Æ® À©µµ¿ì Á¦ÀÛ ÀåÄ¡ ¹× ¹æ¹ý¡± (2016)

[19] KOR Patent 10-1744200, À̼±¿µ, ÃÖ´ÙÇö, À̹ÎÁö, ±èÇü¼·, ±è±¤¹Î, ¡°Åõ¸íÀü±Ø ¹× ±× Á¦Á¶¹æ¹ý°ú À̸¦ ÀÌ¿ëÇÑ Àü±âº¯»ö¼ÒÀÚ¡±

[20] KOR Patent 10-2016-0069170, À̼±¿µ, ±èÇü¼·, ÃÖ´ÙÇö, ±è±¤¹Î, õµÎ¸¸, Ãß¿ø½Ä, ¾È¼ºÈÆ, ¡°Àü±â º¯»öÃþ°ú ÀÌ¿Â ÀúÀåÃþÀ» Æ÷ÇÔÇÏ´Â Àü±â º¯»ö ¼ÒÀÚ ¹× ±× Á¦Á¶¹æ¹ý¡± (2016)

[21] KOR Patent 10-2016-0002737, À̼±¿µ, ÃÖ´ÙÇö, °­Á¦ÀÎ, ±èÀ±ÀÓ, ÀÌÇϸ², ¡°°íµ¥±â ³Ã°¢ Ä¿¹ö¡± (2017)

[22] KOR Patent 10-2017-0033602, À̼±¿µ, ¹ÚÀ±Âù, ±èÇü¼·, ÃÖÁØÇÊ, ¡°¸·ÀÇ ¹Ðµµ ÃøÁ¤ ÀåÄ¡ ¹× À̸¦ ÀÌ¿ëÇÑ ¹Ú¸·ÀÇ ¹Ðµµ ÃøÁ¤ ¹æ¹ý¡± (2017)

[23] KOR Patent 10-2017-0066100, À̼±¿µ, ÃÖ´ÙÇö, À̹ÎÁö, ±èÇü¼·, ±è±Ù¿µ, "Àü±âº¯»ö ¹Ú¸·ÀÇ Á¦Á¶ ¹æ¹ý" (2017)

[24] KOR Patent 10-2017-0097768, õµÎ¸¸, ¹ÚÇÏ´Ï, À̼±¿µ, ¾È¼ºÈÆ, Ãß¿ø½Ä, "±¤Ã˸Š¹Ú¸·Á¦ÀÛÀåÄ¡ ¹× ±¤Ã˸Š¹Ú¸·Á¦ÀÛ¹æ¹ý" (2017)

[25] KOR Patent 10-2017-0106884, À̼±¿µ, ¼Õ¿¬È£, °­¹Î±Ô, °­»ó±Õ, ½Å¼º³², "¼ö¼º µµ·á¿ë Á¶¼º¹°ÀÇ Á¦Á¶ ¹æ¹ý ¹× À̸¦ ÀÌ¿ëÇÑ ¼ö¼º µµ·á¿ë Á¶¼º¹°" (2017)

[26] KOR Patent 10-2017-0121575, À̼±¿µ, °­¼öÈñ, ÀåÁØ¿µ, "Áß°ø ¼¶À¯ º¹ÇÕüÀÇ Á¦Á¶ ¹æ¹ý" (2017)

[27] KOR Patent 10-2017-0172989, À̼±¿µ, À̹ÎÁö, ÃÖ´ÙÇö, ±è±Ù¿µ, "Àü±âº¯»ö ¼ÒÀÚ ¹× ±× Á¦Á¶ ¹æ¹ý, ±×¸®°í Àü±âº¯»ö ¼ÒÀÚ¿ë ÀüÇØÁú" (2017)

[28] KOR Patent 10-2018-0015713, À̼±¿µ, ±è±Ù¿µ, ÃÖ´ÙÇö, ¹ÚÀ±Âù, À̹ÎÁö, "ÇÕ±Ý ¹Ú¸· ¹× ±× Á¦Á¶ ¹æ¹ý" (2018)

[29] KOR Patent 10-2018-0101869, À̼±¿µ, ÃÖ´ÙÇö, À̹ÎÁö, ±èÈ¿ÁØ, "¿¬¼Ó±¸µ¿ Ư¼ºÀÌ Çâ»óµÈ Àü±â º¯»ö ¼ÒÀÚ ¹× ±× Á¦Á¶ ¹æ¹ý" (2018)

[30] KOR Patent 10-2018-0101870, À̼±¿µ, ÃÖ´ÙÇö, ÀÌ»óÁø, Ȳ¿µÁø, "ÇÏÀ̺긮µå Àü±â º¯»ö ¼ÒÀÚ ¹× ±× Á¦Á¶ ¹æ¹ý" (2018)

[31] KOR Patent 10-2018-0102672, À̼±¿µ, ÀåÁØ¿µ, ±èÈ¿ÁØ, "±ÔÁ¶Åä ÆäÀÎÆ® ¹× ±× Á¦Á¶ ¹æ¹ý" (2018)

[32] EP Patent 16904149.8, ±èÇü¼·, À̼±¿µ, ÃÖ´ÙÇö, ±è±¤¹Î, "Electrochromic device including electrochromic layer and ion charge layer, and method of fabricating the same" (2018)

[33] KOR Patent 10-2019-0096639, À̼±¿µ, °­¼öÈñ, ±èÈ¿ÁØ, "ÀÌ»êȭź¼Ò ȯ¿ø ±â´ÉÀ» °®´Â ±Ý¼Ó»êÈ­¹°-ź¼ÒÁúÈ­¹° º¹ÇÕ ³ª³ë¼¶À¯ ¹× ±× Á¦Á¶ ¹æ¹ý" (2019)

[34] KOR Patent 10-2019-0170781, À̼±¿µ, ±è»ç¶óÀº°æ, ÀÓÅÂÇù, "¿­°è¸éÃþÀ» Æ÷ÇÔÇÏ´Â ¹ÝµµÃ¼ ¼ÒÀÚ ÆÐÅ°Áö ¹× ±× Á¦Á¶ ¹æ¹ý" (2019)


[35] KOR Patent 10-2019-0008044, À̼±¿µ, °­¼öÈñ, ÀåÁØ¿µ, "º¹ÇÕ ¼¶À¯, ±×ÀÇ Á¦Á¶ ¹æ¹ý, ¹× ±×¸¦ Æ÷ÇÔÇÏ´Â °¡½º Á¤È­ ½Ã½ºÅÛ" (2019)


[36] KOR Patent 10-2020-0007925, À̼±¿µ, ¼Õ¹ÎÈñ, ÃÖ´ÙÇö, ÃÖ¼ºÁØ, ¼Û½ÂÀº, ¹Ú¼¼Èñ, ÀÌ¿µÁØ, "Àü±âº¯»öÃþÀÇ Á¦Á¶¹æ¹ý ¹× ÀÌ¿¡ µû¶ó Á¦Á¶µÈ Àü±âº¯»öÃþÀ» Æ÷ÇÔÇÏ´Â Àü±âº¯»ö¼ÒÀÚ" (2020)


[37] EP Patent 18854486, ÀåÁØ¿µ, °­¼öÈñ, À̼±¿µ, "Method for preparing hollow fiber composite" (2020)


[38] KOR Patent 10-2020-0046272, À̼±¿µ, °­¼öÈñ, ÇÑÁø¾Æ, ±èÁö¼±, ±ÇÇÏ¿¬, "±â´É¼º °øÁ¶¹°ÁúÀÇ Á¦Á¶¹æ¹ý ¹× °øÁ¶ ÀåÄ¡" (2020)


[39] US Patent 16/904.685, ÀÓÅÂÇù, À̼±¿µ, ±è»ç¶óÀº°æ, "Semiconductor device package comprising thermal interface layer, and method for manufacturing the same" (2020)


[40] KOR Patent 10-2020-0158850, À̼±¿µ, ÀÓÅÂÇù, ¿ÀÈï¼®, "±Ý¼Ó Çǵ彺ÅåÀÇ ¿øÈ°ÇÑ »çÃâÀ» À§ÇÑ ¾ÐÃâ½Ä FDM ±â¹Ý ±Ý¼Ó 3D ÇÁ¸°ÅÍ ³ëÁñÀÇ ÃÖÀûÈ­ Á¶°Ç°ú ±Ý¼Ó Çǵ彺ÅåÀÇ »ó°ü°ü°è" (2020)



[41] KOR Patent 10-2021-0001001, À̼±¿µ, ¼Õ¹ÎÈñ, "½º¸¶Æ® Àü±âº¯»ö ¼ÒÀÚ ¹× ±× Á¦Á¶ ¹æ¹ý" (2021)